Ben Lee in

Ben Lee

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Principal Assembly & Packaging Engineer (OSAT management) at Renesas Electronics
📍 WP. Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

Professional overview including current role context, leadership scope, domain focus, and career trajectory to help you understand background relevance before outreach.

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Experience
23 Years
Current Role
Principal Assembly & Packaging Engineer (OSAT management)
Job Level
Senior
Location
WP. Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
Personality Overview

How Ben shows up

Communication Style
Decision Approach
Work Preference

Behavioral traits and communication patterns that shape how this person evaluates opportunities, builds trust, and makes decisions in professional settings.

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Priorities

Topics Ben cares about

Strategic Priorities
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Career

Work history

9-2017
Principal Assembly & Packaging Engineer (OSAT management)
Renesas Electronics
7-2010 - 9-2016
Principal Assembly & Packaging Engineer (OSAT management)
INTERSIL COMMUNICATIONS INC
2004 - 2010
Sr. R&D Engineer
Freescale Semiconductor
2002 - 2004
Process Engineer
STATS ChipPAC
In the press

Media appearances

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Education
2002 - 2004
Bachelor Degree BEng (Hons)
University Of Wales Swansea, United Kingdom
2000 - 2002
Diploma
Tunku Abdul Rahman College, Malaysia
Social presence
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Behavioral profile

DISC profile (public)

DISC behavioral profile

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