Mike Zylinski
Login to view DISC.Mike is an engineering and operations executive at Power Integrations, leading the global packaging and assembly technology group. With over 20 years at Analog Devices, he has driven major transformations, M&A integrations, and global cost-optimization efforts. He holds a Masters degree from Rensselaer Polytechnic Institute and a Lean Six Sigma Green Belt certification.
Between his senior executive roles, Mike took dedicated time off to travel and reconnect with friends and family. He has also showcased his engaging communication style by co-hosting a live morning show for a global virtual technical conference, connecting with engineering talent across the globe.
Unique fact: Mike is a co-inventor on multiple U.S. patents, including one for creating stress isolation features in stacked semiconductor dies.
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