Bill Phillips, MBA in

Bill Phillips, MBA

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Head of Engineering at INBRAIN Neuroelectronics
📍 Barcelona, Catalonia, Spain

Bill Phillips is an engineering leader with deep expertise in bringing high-tech medical products to market. As Head of Engineering at INBRAIN Neuroelectronics, he leads the development of next-generation neural technologies. His background includes senior roles at Smith+Nephew and Medtronic, and he holds an MBA from the University of Tennessee and a BS in Mechanical Engineering from the University of Minnesota.

He is the inventor on 47 issued US patents within the medical devices and communications industries.

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Experience
11 Years
Current Role
Head of Engineering
Job Level
Mid-senior
Location
Barcelona, Catalonia, Spain
Personality Overview

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Communication Style
Decision Approach
Work Preference

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Priorities

Topics Bill cares about

Neurotechnology Innovation
Currently leading the engineering organization developing next-generation graphene-based neural technologies at INBRAIN Neuroelectronics.
Scaling Engineering Teams
He is actively hiring and focused on scaling his engineering organization's capabilities to drive innovation and deliver real outcomes in the BCI industry.
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Career

Work history

3-2026
Head of Engineering
INBRAIN Neuroelectronics
1-2023 - 3-2026
Sr. Director of Advanced Wound Devices & Engineering
Smith+Nephew
11-2022 - 1-2023
Product Program Director
Medtronic
6-2021 - 11-2022
Sr. Product Program Manager
Medtronic
6-2019 - 6-2021
Sr. Engineering Manager - Systems Engineering
Medtronic
In the press

Media appearances

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Education
Master of Business Administration - MBA
Haslam College of Business at the University of Tennessee
9-1991 - 6-1995
BS - Mechanical Engineering
University of Minnesota
Social presence
in
Behavioral profile

DISC profile (public)

DISC behavioral profile

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