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Gerald Ofner
Vice President at Infineon Technologies
Regensburg, Bavaria, Germany
Overview
Topics They Care About
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Work History
10-2023 - 11-2023
Vice President at Infineon Technologies
1-2021 - 9-2023
Senior Director Platforms and Processes at Infineon Technologies
4-2018 - 12-2020
Director Package Development Sensors at Infineon Technologies
2-2011 - 6-2014
Head of Package Development and Innovation at Intel Mobile Communications GmbH
8-2007 - 1-2011
Head of Development Wafer Level Package at Infineon Technologies
1-2003 - 7-2007
Project Manager Package Development Flip Chip at Infineon Technologies
6-1997 - 12-2002
Package Development Engineer at Infineon Technologies
Education
Mechatronik from ETH Zürich
Mechatronik from Johannes Kepler Universität Linz
More Information
Social Presence :
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Exp : 22
Location : Regensburg, Bavaria, Germany
Job Level : N/A
Designation : Vice President at Infineon Technologies
